Hot Melt molding technology for the protection of electronic boards.
Hot Melt low pressure molding technology allows making connectors and protections of electronic boards in different shapes and sizes with relatively simple and cheap molds. The low injection pressure allows to integrate electronic circuits and delicate components without risk of damage. The relative ease of building the molds allows you to create specially-made connectors that are not on the market.
In 50 years of activity Elettromeccanica Zuccoli has experienced constant growth thanks to continuous technological investments and training of our human resources. Our international vision allows us today to create cabling in line with the specific requests of an ever-growing international market. This experience has allowed us to consolidate a network of collaborations and partnerships outside the italian borders that can increase our know-how and provide quick answers to the needs of our customers all over the world.
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